? semiconductor components industries, llc, 2012 june, 2012 ? rev. p2 1 publication order number: NTNS3A91PZ/d NTNS3A91PZ advance information small signal mosfet ? 20 v, ? 214 ma, single p ? channel, 0.62 x 0.62 x 0.4 mm xllga3 package features ? single p ? channel mosfet ? ultra small and thin package (0.62 x 0.62 x 0.4 mm) ? low r ds(on) solution in 0.62 x 0.62 mm package ? 1.5 v gate voltage rating ? these devices are pb ? free, halogen free/bfr free and are rohs compliant applications ? small signal load switch ? analog switch ? high speed interfacing ? optimized for power management in ultra portable products maximum ratings (t j = 25 c unless otherwise stated) parameter symbol value units drain-to-source voltage v dss ? 20 v gate-to-source voltage v gs 8.0 v continuous drain current (note 1) steady state t a = 25 c i d ? 214 ma t a = 85 c ? 155 t 5 s t a = 25 c ? 277 power dissipa- tion (note 1) steady state t a = 25 c p d 125 mw t 5 s t a = 25 c 208 pulsed drain current t p = 10 s i dm ? 643 ma operating junction and storage temperature t j , t stg -55 to 150 c source current (body diode) (note 2) i s ? 208 ma lead temperature for soldering purposes (1/8 from case for 10 s) t l 260 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. thermal resistance ratings parameter symbol max units junction-to-ambient ? steady state (note 1) r ja 1000 c/w junction-to-ambient ? t 5 s (note 1) r ja 600 1. surface mounted on fr4 board using the minimum recommended pad size, (or 2 mm 2 ), 1 oz cu. 2. pulse test: pulse width 300 s, duty cycle 2%. this document contains information on a new product. specifications and information herein are subject to change without notice. http://onsemi.com g (1) s (2) p ? channel mosfet d (3) ? 20 v 2.4 @ ? 2.5 v 1.6 @ ? 4.5 v r ds(on) max i d max v (br)dss mosfet xllga3 case 713aa x = specific device code m = date code x m 1 3.3 @ ? 1.8 v marking diagram 4.5 @ ? 1.5 v ? 214 ma device package shipping ? ordering information NTNS3A91PZt5g xllga3 (pb ? free) 8000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. 1 2 3
NTNS3A91PZ http://onsemi.com 2 electrical characteristics (t j = 25 c unless otherwise specified) parameter symbol test condition min typ max units off characteristics drain-to-source breakdown voltage v (br)dss v gs = 0 v, i d = ? 250 a ? 20 v zero gate voltage drain current i dss v gs = 0 v, v ds = ? 20 v t j = 25 c ? 1.0 a gate-to-source leakage current i gss v ds = 0 v, v gs = 8.0 v 2.0 a on characteristics (note 3) gate threshold voltage v gs(th) v gs = v ds , i d = ? 250 a ? 0.4 ? 1.0 v drain-to-source on resistance r ds(on) v gs = ? 4.5 v, i d = ? 100 ma 1.3 1.6 v gs = ? 2.5 v, i d = ? 50 ma 1.8 2.4 v gs = ? 1.8 v, i d = ? 20 ma 2.3 3.3 v gs = ? 1.5 v, i d = ? 10 ma 2.8 4.5 source ? drain diode voltage v sd v gs = 0 v, i s = ? 10 ma ? 0.7 ? 1.0 v charges, capacitances & gate resistance input capacitance c iss v gs = 0 v, f = 1 mhz, v ds = ? 15 v 22 pf output capacitance c oss 4.5 reverse transfer capacitance c rss 2.5 switching characteristics, vgs = 4.5 v (note 3) turn-on delay time t d(on) v gs = ? 4.5 v, v dd = ? 15 v, i d = ? 200 ma, r g = 2 41 ns rise time t r 97 turn-off delay time t d(off) 571 fall time t f 286 3. switching characteristics are independent of operating junction temperatures. typical characteristics figure 1. on resistance variation with temperature figure 2. threshold voltage r ds(on) , normalized drain ? to ? source resistance ( ) 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 ? 50 ? 25 0 25 50 75 100 125 150 t j , junction temperature ( c) v gs = ? 4.5 v i d = ? 100 ma t j , temperature junction ( c) ? v gs(th) , gate ? to ? source threshold voltage (v) 0.85 ? 50 ? 25 0 25 50 75 100 125 15 0 i d = ? 250 a 0.75 0.65 0.55 045 0.35 v gs = ? 1.8 v i d = ? 20 ma
NTNS3A91PZ http://onsemi.com 3 package dimensions xllga3, 0.62x0.62, 0.35p case 713aa issue o a b e d bottom view b top view 0.10 c a a1 0.10 c 0.10 c c seating plane side view dim min max millimeters a 0.340 0.440 a1 0.000 0.030 b 0.100 0.200 d 0.620 bsc e 0.620 bsc l 0.090 0.210 solder footprint* dimensions: millimeters 0.595 0.35 0.185 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 1 l2 0.110 0.310 l l2 0.20 recommended pitch b2 0.400 0.600 e2 0.175 bsc e3 0.205 bsc e 0.350 bsc k 0.200 ref 0.10 c a m 0.10 b c m 0.05 c 2x e e/2 e3 e2 k b2 a m 0.10 b c m 0.05 c 2x 2x 2x 0.245 0.55 1 pin one reference 2 3 2 3 on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other intellectual property. a list ing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parame ters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 NTNS3A91PZ/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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